High thermal conductivity silicon nitride ceramic substrate

With the rapid development of semiconductor devices in the direction of high power, high frequency and integration, thermal management has become the focus of ensuring device reliability. In the fields of new energy vehicles, high-speed rail, aerospace, etc., semiconductor devices often face complex mechanical environments such as bumps and vibrations, which imposes stringent requirements on the mechanical properties of materials. Silicon nitride ceramics have the characteristics of high thermal conductivity, high strength, high toughness, etc., and their overall performance is significantly better than that of aluminum oxide, aluminum nitride and other substrate materials, and they are high-end products in ceramic circuit substrates.